| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To manufacture a multilayer-structured board with built-in electronic components with an inkjet process. <P>SOLUTION: The manufacturing method of the multilayer-structured board comprises a process of disposing the electronic component on the surface such that terminals of the electronic component are directed upward, and a first inkjet process of providing a first insulating pattern on the surface so as to embed any step caused by the thickness of the electronic component. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
