| 摘要 |
PROBLEM TO BE SOLVED: To provide a washing method with ozone water capable of removing a resist in a short period of time without increasing a cost, when removing the resist applied on a wafer in a semiconductor manufacturing step. SOLUTION: There is provided a washing method by using ozone water by circulating the ozone water inside a washing tank while supplying the ozone water into the washing tank, wherein as the ozone supplied into the washing tank, the ozone water is used as obtained by dissolving ozone into water, and an ozone concentration is set at 80 ppm or more, a quantity corresponding to about 25% of the ozone water inside the washing tank is supplied per every minute, about 60% of the quantity with respect to the ozone water quantity inside the washing tank is circulated per every minute, and an ozone concentration inside the washing tank is set at 60 ppm or more. Thus, without increasing the ozone water to be supplied to the washing tank, a flow rate of the ozone water inside the washing tank can be increased, and a resist can be removed in a short period of time. COPYRIGHT: (C)2007,JPO&INPIT
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