| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame for a semiconductor laser device that can satisfactorily inspect the semiconductor laser device, in such a state where the semiconductor laser device is arranged by the lead frame for connection, can perform safe conveyance, without allowing the semiconductor laser device to come into contact with a mechanism tool, and further can achieve safe conveyance and positioning. SOLUTION: A substrate for mounting a semiconductor laser element is formed so that it has a step to the thickness direction of the lead frame 11 to a lead frame 12, thus preventing light emitted from the semiconductor laser element from being shielded by the lead frame 12, and hence inspecting the characteristics of the semiconductor laser element in a lead frame state. COPYRIGHT: (C)2007,JPO&INPIT
|
