| 摘要 |
PROBLEM TO BE SOLVED: To provide the heat dissipation structure of an electronic apparatus which is compact and can keep high heat dissipation. SOLUTION: The electronic apparatus is comprised of a circuit board 2 wherein a plurality of heat generators 21 and 22 are mounted on the front and rear surfaces thereof, and an enclosure 1 which can houses a plurality of circuit boards 2 that are faced each other. The enclosure 1 is used for heat dissipation of the heat generators 21 and 22. In such a heat dissipation structure, the enclosure 1 is provided with an internal partition 11 made integral with the side surface 12 of the enclosure in its inside, and two circuit boards 2 are provided in a manner to pinch both sides of the internal partition 11. When the heat generators 21 and 22 mounted on the front and rear sides of the circuit board 2 are pressed down to the internal partition 11, a heat of the heat generators 21 and 22 are transmitted to the internal partition 11, and it is radiated to the outside. COPYRIGHT: (C)2007,JPO&INPIT
|
