| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device that has excellent heat radiation properties, can be manufactured without deteriorating or losing the grounding function of the semiconductor device during a manufacturing process, and hence can achieve stable quality; and to provide a method for manufacturing the semiconductor device. <P>SOLUTION: There are provided a semiconductor element 4 mounted on the die pad 2 supported by a plurality of suspension leads 10; a plurality of leads 6 for signals electrically connected to the semiconductor element 4 by a plurality of metal wires 5; and a sealing resin body 8 for sealing the mounting surface of the semiconductor element 4 on the die pad 2, the semiconductor element 4, the first metal wire 5, and the lead 6 for signals. A surface 2c at a side opposite to the mounting surface of the semiconductor element 4 on the die pad 2, and a surface 6a at a side opposite to the connection surface of the metal wire 5 in the lead 6 for signals, are exposed to the lower surface of the sealing resin body 8. A widening section 7 is formed at least at one suspension lead 10. At least a part of the widening section 7 is arranged outwardly as compared with the semiconductor element 4, and the bottom surface of the widening section 7 is exposed to the lower surface of the sealing resin body 8. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
