| 摘要 |
PROBLEM TO BE SOLVED: To provide an acidic solution for electrolytic copper plating, which inhibits a sulfur-containing organic compound contained in an electrolytic bath as an additive from being abnormally consumed in an early stage after the bath has been made up, consumes little sulfur-containing organic compound due to electrolysis even in a normal electroplating process, and further, does not adversely affect characteristics of a copper plated film to be formed, and to provide an electrolytic copper plating method which consumes little sulfur-containing organic compound due to the electrolysis. SOLUTION: The acidic solution for electrolytic copper plating includes the sulfur-containing organic compound and a divalent manganese compound. The electrolytic copper plating method which consumes little sulfur-containing organic compound due to electrolysis includes conducting electroplating in the above acidic solution for electrolytic copper plating. COPYRIGHT: (C)2007,JPO&INPIT
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