发明名称 |
Substrate processing apparatus, substrate processing method, and substrate holding apparatus |
摘要 |
The present invention relates to a substrate processing apparatus and a substrate processing method for performing a chemical liquid process, a cleaning process, a drying process, or the like while rotating a substrate such as a semiconductor wafer or a liquid crystal substrate. The present invention also relates to a substrate holding apparatus for holding and rotating a substrate. The substrate processing apparatus ( 1 ) for processing a substrate (W) while supplying a fluid to the substrate (W) includes a substrate holder ( 11 ) for holding and rotating the substrate (W), and a holder suction unit (24) for sucking the fluid from the substrate holder ( 11 ). The substrate holding apparatus includes a plurality of rollers (20) which are brought into contact with an edge portion of a substrate (W) so as to hold and rotate the substrate (W), and at least one moving mechanism ( 303 a) for moving the rollers ( 20 ).
|
申请公布号 |
US2006234503(A1) |
申请公布日期 |
2006.10.19 |
申请号 |
US20040564980 |
申请日期 |
2004.07.28 |
申请人 |
YAMADA KAORU;SAITO TAKAYUKI;YABE SUMIO;ITO KENYA;KAMEZAWA MASAYUKI;SEKI MASAYA;KATAKABE ICHIRO;INOUE YUKI |
发明人 |
YAMADA KAORU;SAITO TAKAYUKI;YABE SUMIO;ITO KENYA;KAMEZAWA MASAYUKI;SEKI MASAYA;KATAKABE ICHIRO;INOUE YUKI |
分类号 |
H01L21/44;B08B1/04;B08B3/02;B65G47/91;C23C18/16;C25D7/12;H01L21/00;H01L21/304;H01L21/306 |
主分类号 |
H01L21/44 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|