发明名称 Substrate processing apparatus, substrate processing method, and substrate holding apparatus
摘要 The present invention relates to a substrate processing apparatus and a substrate processing method for performing a chemical liquid process, a cleaning process, a drying process, or the like while rotating a substrate such as a semiconductor wafer or a liquid crystal substrate. The present invention also relates to a substrate holding apparatus for holding and rotating a substrate. The substrate processing apparatus ( 1 ) for processing a substrate (W) while supplying a fluid to the substrate (W) includes a substrate holder ( 11 ) for holding and rotating the substrate (W), and a holder suction unit (24) for sucking the fluid from the substrate holder ( 11 ). The substrate holding apparatus includes a plurality of rollers (20) which are brought into contact with an edge portion of a substrate (W) so as to hold and rotate the substrate (W), and at least one moving mechanism ( 303 a) for moving the rollers ( 20 ).
申请公布号 US2006234503(A1) 申请公布日期 2006.10.19
申请号 US20040564980 申请日期 2004.07.28
申请人 YAMADA KAORU;SAITO TAKAYUKI;YABE SUMIO;ITO KENYA;KAMEZAWA MASAYUKI;SEKI MASAYA;KATAKABE ICHIRO;INOUE YUKI 发明人 YAMADA KAORU;SAITO TAKAYUKI;YABE SUMIO;ITO KENYA;KAMEZAWA MASAYUKI;SEKI MASAYA;KATAKABE ICHIRO;INOUE YUKI
分类号 H01L21/44;B08B1/04;B08B3/02;B65G47/91;C23C18/16;C25D7/12;H01L21/00;H01L21/304;H01L21/306 主分类号 H01L21/44
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