发明名称 Method for forming silicide and semiconductor device formed thereby
摘要 A method for forming silicide and a semiconductor device formed thereby. A Si-containing polycrystalline region is converted to an amorphous region, and annealed to form a regrown polycrystalline region having an increased grain size. A silicide layer is formed by reacting a metal and the regrown polycrystalline region having the increased grain size.
申请公布号 US2006231910(A1) 申请公布日期 2006.10.19
申请号 US20050107625 申请日期 2005.04.15
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 HSIEH TUNG-HENG;CHENG CHIEN-LI;MOR YI-SHIEN;CHEN YUNG-SHUN
分类号 H01L29/78;H01L21/44 主分类号 H01L29/78
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