| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that a post 6 for supporting a solder ball 7 to be arranged on the surface of a sealing resin layer 5 is easily broken because it undergoes a force due to thermal expansion of the solder ball 7 in mounting and an internal stress concentrates around the post 6. <P>SOLUTION: The post 6 for supporting one solder ball 7 to be provided on the surface of the sealing resin layer 5 consists of a plurality of posts 61, 62. The posts 61 and 62 are a post 61 erected along the periphery of the solder ball 7 to be supported and a post 62 provided in its inside. Since the posts 61 and 62 are provided to support one solder ball 7, the diameter of each of the posts 61 and 62 can be reduced, and a post having a so-called quake-absorbing structure is realized to improve mounting reliability. <P>COPYRIGHT: (C)2007,JPO&INPIT |
