| 摘要 |
PROBLEM TO BE SOLVED: To provide a testing method capable of enhancing a through-put of a PBSOA proof level test for a semiconductor element, and capable of reducing a cost for finding a defective element. SOLUTION: A quality judging specification value for an avalanche proof level test carried out as substitution for the PBSOA proof level test for securing a PBSOA proof level is determined based on a sample of the testing objective semiconductor element. A quality judging specification result for the avalanche proof level test of the testing objective semiconductor element on a wafer carried out using the determined specification value as the specification value for the avalanche proof level test is made to serve as a quality judged result in the avalanche proof level test of the testing objective semiconductor element. The avalanche proof level test tested by a wafer tester is carried out as the substitution for the PBSOA proof level test difficult to be tested by the wafer tester, and the PBSOA proof level test executed conventionally after a module is assembled can be executed under a chip condition. COPYRIGHT: (C)2007,JPO&INPIT
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