发明名称 SPLITTING METHOD OF PLATE-LIKE BODY AND METHOD FOR MANUFACTURING PLATE-LIKE SPLIT BODY
摘要 PROBLEM TO BE SOLVED: To provide a splitting method of a plate-like body, which can prevent an installation face, on which an electronic component is installed after splitting, from being contaminated and blemished, and a method for manufacturing a plate-like split body. SOLUTION: In the splitting method of the plate-like body, the plate-like body 6, in which a splitting groove 7 for splitting is formed to a splitting scheduled part beforehand, is split along the splitting groove 7. After the plate-like body 6 is placed on a plate-like body placing die 11 on which the plate-like body 6 can be placed in a state of being deflected into an arcuate curved face shape, the plate-like body 6 is split by deflecting the plate-like body 6 into a curved face shape by pressing the splitting scheduled part from the upper face of the plate-like body 6. Consequently, insulating substrates 1 can be formed. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006281324(A) 申请公布日期 2006.10.19
申请号 JP20050100658 申请日期 2005.03.31
申请人 MITSUBISHI MATERIALS CORP 发明人 TAKITA KENJI;SATO HIROAKI
分类号 B26F3/00;B28D5/04;H05K3/00 主分类号 B26F3/00
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