| 摘要 |
<p>An electronic component handling apparatus is provided for testing electrical characteristics of an electronic component by transferring the electronic component to a socket of a contact section and electrically connecting the electronic component to the socket. Reference image data, which is socket image data to be a reference, is previously stored, inspection image data, which is socket image data to be inspected, is acquired by image pickup of an image pickup apparatus, the reference image data is read out from a storage device, and a socket failure to be inspected is detected by comparison between the reference image data and the inspection image data.</p> |
