| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily and economically manufacture a semiconductor substrate having a semiconductor layer row provided with active zones suitable for a lateral principal extending direction, a principal surface, and the generation of radiation, and a radiant emission semiconductor chip provided with an electrical connection element disposed on the principal surface that can be pulse-operated in a reduced modulation time. <P>SOLUTION: The principal surface has an injection region 7 and an isolation region 8, the injection region is conductively connected to a connection element, A carrier is injected into a semiconductor substrate through the injection region only while the semiconductor chip is in operation relative to the isolation region and the injection region, and the connection element is overlapped on the injection region or the isolation region, or is disposed adjacent to the injection region in a lateral direction. <P>COPYRIGHT: (C)2007,JPO&INPIT |
