SEMICONDUCTOR CHIP HAVING LAYER SEQUENCE REGULATED FOR FORMING SOLDER JOINTS, AND METHOD FOR FORMING SOLDER JOINT BETWEEN SUPPORT AND THE SEMICONDUCTOR CHIP

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor chip having a layer sequence that is improved and excellent in the respect of improving oxidation protection of solder layers in particular, which is regulated for forming solder joints.

SOLUTION: A semiconductor chip is provided with a layer sequence regulated for forming solder joints, in which this layer sequence further has solder layers and an oxidation protection layer following the solder layers when looked at in relation to the semiconductor chip. A barrier layer is provided between the solder layers and the oxidation protection layer.

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