| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electrode plate for plasma etching, in which etching properties are improved and the yield of silicon wafer is improved, and to provide a plasma etching device mounted with the electrode plate. <P>SOLUTION: A recyclable composite upper electrode plate for plasma etching device is constituted by two-disc type electrode plates of a first electrode plate and a second electrode plate. (a) To the first electrode plate, a through-hole for gas blowing-out is provided; and further at least one penetrating first fixing hole is provided for joining with the second electrode plate; and a second electrode plate facing a lower electrode side of the plasma etching device is provided with a second fixing hole, which has the almost same diameter as the first fixing hole, protrudes no fixing jig on the wafer surface side, and has a specified depth. (b) The first electrode plate and the second electrode plate are fixed/joined together using the fixing jig from the first electrode plate side through the first and second fixing holes. <P>COPYRIGHT: (C)2007,JPO&INPIT |
