| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser marking apparatus which can suppress scattering of a silicon after it is melted in case when a mark is put on a semiconductor wafer by laser, especially, a first dot is marked after a first dot and a decimal point of a laser mark is put by laser, and to provide a laser marking method. <P>SOLUTION: The laser marking apparatus is used to put a mark on a semiconductor wafer by using laser, and it is provided with at least a laser light source to emit a laser light, a scanning means to scan the semiconductor wafer by the laser light, and a shielding means that is arranged between the scanning means and the semiconductor wafer. The shielding means can shield the laser light of which advancing direction is changed by the scanning means, before the laser light reaches the semiconductor wafer. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
