| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive tape for wafer dicing, which does not worsen chipping during the dicing of small chips and has excellent expandability of chipping in a process of expanding. SOLUTION: The adhesive tape for wafer dicing is characterized by having an intermediate layer as a layer constituting a supporting film or in between a supporting film and an adhesive agent layer coated on the above supporting film. The tape reversibly changes, softens and hardens, at ambient temperature. COPYRIGHT: (C)2007,JPO&INPIT |
