发明名称 SEMICONDUCTOR PACKAGE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor package which has high electric connection reliability. SOLUTION: The semiconductor package is equipped with a die pad 3 to which a semiconductor chip 2 is bonded, a plurality of leads 5 which are provided apart around the die pad 3 and electrically connected to the semiconductor chip 2 by wires 4, and a package 6 provided on the semiconductor chip 2 and leads 5. Each of the leads 5 has a bent part 12 outside on the opposite side from a connection part 11 to which a wire 4 is electrically connected, and the bent part 12 is formed almost in level with a flank 6b of the package part 6. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006287131(A) 申请公布日期 2006.10.19
申请号 JP20050107853 申请日期 2005.04.04
申请人 SONY CORP 发明人 MOCHIZUKI KEIKO
分类号 H01L23/50;H01L21/56;H01L23/28 主分类号 H01L23/50
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