| 摘要 |
PROBLEM TO BE SOLVED: To improve the soldering quality of a chip type capacitor. SOLUTION: In the chip type capacitor comprising a capacitor body and an insulating plate disposed on the lead-wire deriving end-surface of the capacitor body, lead wires passed through the insulating plate are so folded as to separate the insulating plate 7 from the mounting surface of a substrate, and as to use the lead wires as electrodes 10, 10 for connecting the capacitor with the substrate. Also, protrusions 9, 9 for supporting the electrodes 10, 10 are provided on the insulating plate 7. Further, supporting legs 11 are provided on the four corners of the insulating plate 7. Since the electrodes 10, 10 are disposed separately from the insulating plate 7, the heat applied to the electrodes 10, 10 is so transferred and so diffused scarcely to the insulating plate 7 that the soldering of the capacitor is performed surely. COPYRIGHT: (C)2007,JPO&INPIT
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