| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board having uniform the impedance of a signal wiring film. SOLUTION: Centered at a signal wiring film 20 with its width W arranged on the surface of the substrate, the presence of a grounding wiring film parallel to the film 20 is eliminated within a range 7W around the film 20. With this configuration, the difference in impedance between the film 20 near an end of a base film 11 and the film 20 at a far position can be especially reduced when a high frequency signal is used, and the wiring board having a good characteristic can be obtained. COPYRIGHT: (C)2007,JPO&INPIT
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