| 摘要 |
On a semiconductor wafer 10 , semiconductor chip regions 12 including a semiconductor integrated circuit, a scribe line 14 formed adjacent to the semiconductor chip region 12 , a test device 18 formed in the scribe line 14 , electrically separated from the semiconductor circuit in the semiconductor chip region 12 , for controlling a tester signal in testing the semiconductor integrated circuit are provided, and the semiconductor integrated circuit of the semiconductor chip region 12 and the test device 18 are electrically connected to each other through lines 38 <SUB>L</SUB> , 38 <SUB>R </SUB>provided in a probe card 16.
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