| 摘要 |
An integrated heat sink device, which is utilized to dissipate the heat generated by heat-generating elements with different angles of radiation surface (for instance, CPU and display chip are with radiation surfaces at 180° and 90°), is provided. The integrated heat sink device comprises a thermal module and a fan module; wherein the thermal module further comprises a first heat conduction module, a fin set, and a second heat conduction module; wherein the fan module, its vent connects with the fin set in an air-tight manner in order to form a heat-dissipating channel; and the first and second heat conduction modules are with different angles of heat connected surfaces so that the invention of the integrated heat sink device can dissipate the heat generated by heat-generating elements with different angles of radiation surface.
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