DEVICE MOUNTING STRUCTURE, METHOD OF MOUNTING DEVICE, DROPLET DELIVERY HEAD, DRIVE UNIT AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To mount a device with sufficient yield with outstanding reliability without reducing workability at the time of performing an electrical connection even when the pitch of forming a connection terminal and a connection section is narrow.

SOLUTION: An electrically conductive connection section 80 provided in the recess 700 of a substrate and the connection terminal 200a of devices 200A and 200B separated from the electrically conductive connection section 80 are electrically connected. The device mounting structure has a substrate section 41 in which the the devices 200A and 200B are provided to the first surface 41a of one side, a protrusion 42 in which the terminal electrode 36b is provided in the second surface 42b projected and arranged rather than the first surface 41a, and a unit 360 having connecting wiring 36d electrically connecting the connection terminal 200a and the terminal electrode 36b of the devices 200A and 200B. The protrusion 42 is inserted in the recess 700 and the terminal electrode 36b is connected to the electrically conductive connection section 80.

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