| 摘要 |
PROBLEM TO BE SOLVED: To provide a joined structure-manufacturing method capable of dispersing voids and reducing the number of the voids while suppressing generation of solder balls in the joining using a lead-free solder. SOLUTION: In the joined structure-manufacturing method, a plurality of bodies to be joined are joined with each other via a solder. A lead-free solder containing at least one of zinc and indium is used for the solder. (1) The atmosphere is substituted with non-oxidizing gas while the plurality of bodies face each other via the solder. (2) The pressure in the atmosphere is dropped to the first pressure lower than the atmospheric pressure, and the temperature is raised to the value higher than the melting point of the solder. (3) The pressure is increased up to the pressure higher than the first pressure and not exceeding the first pressure with the non-oxidizing gas while the raised temperature is maintained. (4) The pressure is again reduced while the raised temperature is maintained. (5) The pressure is increased again to the pressure not exceeding the atmospheric pressure with the non-oxidizing gas while the raised temperature is maintained. (6) The temperature is dropped to the temperature lower than the melting point of the solder. COPYRIGHT: (C)2007,JPO&INPIT |
