| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a thin film-fitted glass substrate where the stress by a thin film on a glass substrate is relaxed, the amount of the warpage in the glass substrate is reduced, the working precision of the thin film in a poststage is improved, and also, its sticking to a semiconductor wafer having a plurality of semiconductor devices is made possible with high precision, and to provide a thin film-fitted glass substrate. SOLUTION: The glass substrate 3 having one or more grooves 2 for reducing the warpage of the substrate on the surface and a thin film 4 formed at the surface of the glass substrate 3 and at the inside face of each groove 2, are included. The groove 2 has an aspect ratio of 1 to 10, expressed by the ratio of the depth of each groove to the width of the bottom part of each groove, and the thin film 4 has a level difference covering coefficient of≤0.5, expressed by the ratio of the minimum film thickness in the thin film part formed at the inside face of each groove to the film thickness of the thin film part formed on the surface of the glass substrate. COPYRIGHT: (C)2007,JPO&INPIT
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