发明名称 |
LED PACKAGE HAVING HOOK AND HOOK-RECEIVING GROOVE, ASSEMBLY OF SUCH LEDS AND LIGHTING EQUIPMENT |
摘要 |
An LED package having a hook and a hook groove is provided to easily interconnect several LED packages while using a metal substrate by forming a hook on one surface of an LED package and by forming a hook groove of the same type as the hook on the opposite surface to the surface on which the hook is formed. A first lead is electrically connected to an LED chip(140), supporting the LED chip. A second lead is electrically connected to the LED chip, maintaining a predetermined interval between the first and the second leads. A concave part for opening the LED chip to the outside is formed in a package body(110), coupled to the LED chip and surrounding the circumference of the LED chip. A hook(116) of a convex type is formed on one surface of the package body, and a hook groove(118) capable of being coupled to the hook is formed on the other surface of the package body. A transparent encapsulation body is formed in the concave part to encapsulate the LED chip. The hook and the groove are constructed in a manner that a plurality of LED packages(100) are coupled in a planar direction.
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申请公布号 |
KR100638877(B1) |
申请公布日期 |
2006.10.19 |
申请号 |
KR20050070807 |
申请日期 |
2005.08.02 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
SEO, JUN HO;PARK, JUNG KYU;KIM, BYUNG MAN |
分类号 |
H01L33/48 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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