| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC card with durability to an impulsive load which produces a rapid stress, repeated bending stress and repeated local load or the like, and to improve the flatness of a card surface with a high level. <P>SOLUTION: An IC module 40 is provided with at least an antenna coil 41 and an IC chip 42, and the IC chip 42 is provided with a reinforcing board 43. When a distance from the center of gravity of the reinforcing board 43 to the furthest point is defined as d1, and a distance from the center of gravity of the IC chip 42 to the furthest point is defined as d2, relation of 6≥d1/d2≥1.3 is satisfied, and relation of 5≥d3/d4≥1.5 is satisfied between the maximum thickness d3 of the reinforcing board 43 and the maximum thickness d4 of the IC chip 42. <P>COPYRIGHT: (C)2007,JPO&INPIT |
