| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of bonding wiring board capable of suppressing electric continuity failure or short circuit at contiguous wiring, since it is less liable to generate migration even if the distances between adjoining wiring becomes small. SOLUTION: While arranging a glass substrate 5 and a flexible printed circuit board 7 so that a portion wherein two or more first wiring 4 are formed may be counterposed in a predetermined region to a portion wherein two or more second wiring 6 are formed, a first adhesive agent 1 and a second adhesive agent 11 in the predetermined region are arranged so that the first adhesive agent 1 and the second adhesive agent 11 may be narrowly pressurized by the glass substrate 5 and the flexible printed circuit board 7. On the occasion of the narrow pressurization of the adhesive agent, the second adhesive agent 11 is arranged at the periphery of the predetermined region so that the first adhesive agent 1 may be prevented from at least partially overflowing from the predetermined region by the second adhesive agent 11. A portion 3 is a sealing resin. COPYRIGHT: (C)2007,JPO&INPIT
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