| 摘要 |
PROBLEM TO BE SOLVED: To provide a novel epoxy compound which has a lower melting point and is capable of serving as a raw material for an epoxy resin cured product. SOLUTION: The epoxy compound is represented by formula (1) (wherein R<SP>1</SP>, R<SP>2</SP>, R<SP>3</SP>and R<SP>4</SP>are each a hydrogen atom or the like; Y is a group represented by formula (Y-1) or (Y-2); R<SP>5</SP>is a hydrogen atom or a 1-8C alkyl group; R<SP>6</SP>, R<SP>7</SP>and R<SP>8</SP>are identical to or different from each other and are each a hydrogen atom, a 1-8C alkyl group, a halogen atom, a cyano group or a nitro group; and Z is a single bond, an oxygen atom or a 1-8C alkylene group, provided that a methylene group or two or more methylene groups not adjacent to each other composing the 1-8C alkylene group are optionally substituted by oxygen atoms). COPYRIGHT: (C)2007,JPO&INPIT |
