发明名称 Semiconductor device and method of fabricating the same
摘要 According to an aspect of the invention, there is provided a semiconductor device comprising a capacitor formed above a semiconductor substrate by sandwiching a dielectric film between a lower electrode and an upper electrode including an electrode film which contains an MO<SUB>x </SUB>type conductive oxide (M is a metal element, O is an oxygen element, and x>0), and a contact connected to the upper electrode, wherein a film thickness of the electrode film immediately below the contact is smaller than a film thickness of the electrode film in the other portion.
申请公布号 US2006234442(A1) 申请公布日期 2006.10.19
申请号 US20060404000 申请日期 2006.04.14
申请人 YAMAZAKI SOICHI;YAMAKAWA KOJI 发明人 YAMAZAKI SOICHI;YAMAKAWA KOJI
分类号 H01L21/8242;H01L21/20 主分类号 H01L21/8242
代理机构 代理人
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