| 摘要 |
PROBLEM TO BE SOLVED: To enable an easy removing of protective layer after development which protected liquid solder resist layer at the time of exposure or development. SOLUTION: The method comprises the steps of: forming liquid solder resist layers 11, 21 having photosensitivity in at least one side of printed circuit board 1; forming resin coats 12, 22 having water solubility or weak alkali solubility on the solder resist layers 11, 21; exposing the solder resist layers 11, 21 through the resin coats 12, 22; and exposing exposure portions 16, 26 of the solder resist layers 11, 21 by removing the resin coats 12, 22 with a developer. COPYRIGHT: (C)2007,JPO&INPIT
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