| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate for a wiring board having low coefficient of water absorption and coefficient of thermal expansion and capable of being efficiently machined by an alkaline etchant. SOLUTION: At least one layer of a polyimide film constituting the laminate contains a repeating unit of 10 to 80 mol% shown in general formula (1), and the repeating unit of 10 to 80 mol% shown in general formula (2). COPYRIGHT: (C)2007,JPO&INPIT
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