发明名称 STACKED COOLER
摘要 <P>PROBLEM TO BE SOLVED: To provide a stacked cooler which can hold many electronic parts while keeping sizes in passage forming direction and laminating direction small, and cooling performance simultaneously. <P>SOLUTION: The stacked cooler 1 comprises a plurality of cooling pipe 2 for pinching an electronic part 4; and a pair of cooling medium header which engages both ends of a plurality of the cooling pipes 2, respectively, and fixes a plurality of the cooling pipe 2 in lamination. A cooling medium passage 21 formed inside each cooling pipe 2 communicates header passage formed within each cooling medium header with the both ends, respectively. The cooling pipe 2 is constituted so that a plurality of the electronic parts 4 may be pinched in the state of one line by pointing a crossing direction W perpendicular to the laminating direction D of the cooling pipe 2 and a passage forming direction L of the cooling medium passage 21. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006287108(A) 申请公布日期 2006.10.19
申请号 JP20050107549 申请日期 2005.04.04
申请人 DENSO CORP 发明人 ABEI ATSUSHI;INAGAKI MITSUHARU
分类号 H01L23/473;H01L23/40;H02M7/48 主分类号 H01L23/473
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