| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To achieve a reliable and low-cost good bonding even if it is the case where a semiconductor device is jointed to a substrate with coarse front surfaces, such as a ceramic substrate. <P>SOLUTION: A method of manufacturing the semiconductor device includes a step of thermally compressing a golden bump 50 combined with ultrasonic wave heatment to the connection electrode 43 of the ceramic substrate 40, a step of pressurizing and flattening the golden bump 50 with a flat tool 60, and a step of supplying a flux on the golden bump 50. The method further includes a step of forming a solder film in the terminal of an LED and mounting the LED on the ceramic substrate 40, and a step of heating the ceramic substrate 40 and melting the solder film and joining the terminal and the connection electrode 43 of the LED. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
