| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a flexible copper clad laminated sheet excellent in peel strength and heat resistance and especially excellent in visibility and capable of being utilized in a printed circuit board, a flexible printed circuit board or the like, especially in a chip-on film. SOLUTION: A copper foil having gloss, a surface roughness Ra of 0.15 or below and a thickness of 15μm or below is coated with a polyimide precursor resin solution and the coated copper foil is dried so that the residual solvent of the applied polyimide precursor resin solution becomes 10-80 mass%. After a polyimide film is laminated on the polyimide precursor resin solution layer, the polyimide precursor resin solution layer is imidated. COPYRIGHT: (C)2007,JPO&INPIT |
