发明名称 Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same
摘要 Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) an organophosphinate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and electrical characteristics (anti-migration properties). The composition can be used for producing an adhesive sheet, a coverlay film, and a flexible copper-clad laminate.
申请公布号 US2006234045(A1) 申请公布日期 2006.10.19
申请号 US20060402063 申请日期 2006.04.12
申请人 SHIN-ETSU CHEMICAL CO., LTD. 发明人 NAKANISHI TORU;KONDO KAZUNORI;HOSHIDA SHIGEHIRO;AMANO TADASHI
分类号 B32B7/12;B32B3/00 主分类号 B32B7/12
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