| 摘要 |
A semiconductor device assembly comprises within an envelope (100) one or more upper component bodies (102, 103) mounted on a lower component body (101) to provide a low-cost, yet reliable half-bridge or full-bridge driver or rectifier circuit or a solenoid driver circuit or the like. Each component body (101, 102, 103) comprises a power MOSFET, IGBT, Schottky diode and/or other semiconductor component. A bottom main electrode (29a) of the lower body (101) is bonded to a mounting pad (130) in the envelope (100). Electrical connections (150) are bonded from conductor leads (140) of the envelope lead frame (130, 140) to respective bonding pads (124a/b/c, and 121a/b/c) of the top electrodes (24a/b/c; (21a/b/c) of the bodies (101, 102, 103). The lead-frame connection (150) to the bottom electrode (29b/d) of the upper body (102, 103) is via the top main electrode (24a/c) of the lower body (101), to which it is bonded without covering the electrode bonding pads (124a/c, 121a/c) of the lower body (101). A large mounting area for the upper body/bodies (102, 103) and good thermal protection for the whole assembly is achieved by including in the lower body (101) a thermal-overload protection circuit (D1, Q1 . . . ) which has a temperature sensor (D1) at a location adjacent to the area of the top surface of the lower body (101) where the upper body (102) or bodies (102, 103) is/are mounted. |
