<p>The present invention relates to a light-emitting device comprising at least one light-emitting diode (LED) chip (12), and an inorganic optical element (14) being connected to the chip(s) by means of a bond (16). The light-emitting device is characterized in that the bond is of a bonding material comprising a matrix including silicon and oxygen atoms with hydrocarbon groups directly bonded to at least a fraction of the silicon atoms. Such inorganic-organic bonding material has very high photo and thermal stability. As a result, high power and high lumen LED chips can be deployed, whereby high brightness light- emitting devices can be realized. The present invention also relates to a method for the manufacture of such light-emitting device.</p>
申请公布号
WO2006109261(A1)
申请公布日期
2006.10.19
申请号
WO2006IB51128
申请日期
2006.04.12
申请人
KONINKLIJKE PHILIPS ELECTRONICS N.V.;VERSCHUUREN, MARCUS, A.;PEETERS, MARTINUS, P., J.;KEURSTEN, THEODORA, A., P., M.;DE GRAAF, JAN
发明人
VERSCHUUREN, MARCUS, A.;PEETERS, MARTINUS, P., J.;KEURSTEN, THEODORA, A., P., M.;DE GRAAF, JAN