发明名称 LED ASSEMBLY HAVING LED PACKAGE INSERTED INTO METAL BOARD
摘要 An LED in which an LED package is inserted into a metal substrate is provided to easily radiate the heat generated from an LED chip and reduce the size of the LED assembly by inserting the LED package into a metal substrate. A concave part is formed in one surface of a metal substrate(132). An insulation layer(136) is formed on one surface of the metal substrate including the concave part. A circuit pattern(138,140) is formed on the bottom of the insulation layer having the concave part. A substrate part includes the metal substrate, the insulation layer and the circuit pattern. An LED package includes a pair of leads(112,114), an LED chip and a transparent package body. The pair of leads is electrically connected to the circuit pattern, separated from each other. The LED chip is electrically connected to the lead. The leads and the LED chip are encapsulated by the transparent package body. The LED package is inserted into the concave part of the substrate part. The LED package is coupled to the substrate part by a coupling unit. The coupling unit can be solder that couples the circuit pattern to the lead.
申请公布号 KR100638881(B1) 申请公布日期 2006.10.19
申请号 KR20050076166 申请日期 2005.08.19
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 SEO, JUN HO;KIM, BYUNG MAN;BAEK, JONG HWAN
分类号 H01L33/48 主分类号 H01L33/48
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