MULTILAYER BODY FOR FORMING BASE WITH WIRING, BASE WITH WIRING, AND METHODS FOR MANUFACTURING THOSE

摘要

A multilayer body for forming a base with wiring is disclosed wherein a silver material is used for a conductive layer and the conductive layer is protected by being covered with a conductive protection layer. The contact resistance between the conductive protection layer of this multilayer body and a cathode superposed thereon is extremely low. Specifically, disclosed is a multilayer body for forming a base with wiring which comprises a base, a conductive layer formed on the base and containing silver or a silver alloy, and a conductive protection layer which is formed on the conductive layer as to cover the conductive layer and contains an indium zinc oxide. The conductive protection layer is formed through sputtering in such an atmosphere wherein the oxidizing gas content in the sputtering gas is not more than 1.5 volume%.