| 摘要 |
Disclosed herein is a heat sink comprising a substrate of insulating ceramic and, superimposed on its upper surface, a diamond film for disposing an element thereon, which heat sink is excellent in heat radiation characteristics and can be stably used. This heat sink is obtained by providing a substrate of ceramic containing aluminum nitride of high thermal conductivity as a principal component; forming on the substrate a bonding member layer, such as a silicon film which is capable of being bonded with the substrate and a diamond film; and forming a polycrystalline diamond film of high quality on the bonding member layer so that the polycrystalline diamond film is strongly bonded with the substrate via the bonding member layer interposed therebetween in accordance with, for example, the vapor phase method. <IMAGE> |
