发明名称 |
Power semiconductor module with connecting tracks and with connecting elements connected to the connecting tracks |
摘要 |
The module has connecting units (40) and/or fastener designed as a blunt edged metallic molded part arranged on connecting strips (54). The units and the fastener include contact surfaces for the strip and/or power semiconductor component. Each contact surface is designed as a set of partial contact surfaces where each partial surface has a maximum surface area. The partial surfaces are connected to the strip and/or the component by a solder connection without lead such that the strip and the components flush with each other. |
申请公布号 |
EP1713124(A2) |
申请公布日期 |
2006.10.18 |
申请号 |
EP20060007011 |
申请日期 |
2006.04.01 |
申请人 |
SEMIKRON ELEKTRONIK GMBH & CO. KG PATENTABTEILUNG |
发明人 |
STEGER, JUERGEN;MANZ, YVONNE |
分类号 |
H01L25/07;H01L23/492;H01L23/498;H05K1/03;H05K1/14;H05K3/22;H05K3/34 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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