发明名称 Power semiconductor module with connecting tracks and with connecting elements connected to the connecting tracks
摘要 The module has connecting units (40) and/or fastener designed as a blunt edged metallic molded part arranged on connecting strips (54). The units and the fastener include contact surfaces for the strip and/or power semiconductor component. Each contact surface is designed as a set of partial contact surfaces where each partial surface has a maximum surface area. The partial surfaces are connected to the strip and/or the component by a solder connection without lead such that the strip and the components flush with each other.
申请公布号 EP1713124(A2) 申请公布日期 2006.10.18
申请号 EP20060007011 申请日期 2006.04.01
申请人 SEMIKRON ELEKTRONIK GMBH & CO. KG PATENTABTEILUNG 发明人 STEGER, JUERGEN;MANZ, YVONNE
分类号 H01L25/07;H01L23/492;H01L23/498;H05K1/03;H05K1/14;H05K3/22;H05K3/34 主分类号 H01L25/07
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