发明名称 |
POLISHING ENDPOINT DETECTION SYSTEM AND METHOD USING FRICTION SENSOR |
摘要 |
<p>A system, method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of a substrate. At least a portion of the top surface is substantially coplanar with the polishing surface. A sensor is provided to measure a lateral displacement of the substrate contacting member. Some embodiments may provide accurate endpoint detection during chemical mechanical polishing to indicate the exposure of an underlying layer.</p> |
申请公布号 |
KR20060108701(A) |
申请公布日期 |
2006.10.18 |
申请号 |
KR20067010761 |
申请日期 |
2004.10.28 |
申请人 |
APPLIED MATERIALS INC. |
发明人 |
MILLER GABRIEL LORIMER;BIRANG MANOOCHER;JOHANNSON NILS;SWEDEK BOGUSLAW A.;BENVEGNU DOMINIC J. |
分类号 |
G01N19/02;B24B37/04;B24B49/16 |
主分类号 |
G01N19/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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