Method of manufacturing printed writing board

摘要

A method of producing a printed wiring board is disclosed comprising the steps of providing a substrate (1) with at least one concave (13); forming a first circuit pattern (30) on said substrate; forming a second circuit pattern (34) isolated from the first circuit pattern (30) in said substrate; covering the concave (13) with a material different from said substrate to obtain a cover portion (15); forming a conductive layer (40) on said cover portion (15) to make a temporary electrical connection between the first and second circuit patterns (30,34); performing electroplating by the passage of electric current through the first and second circuit patterns (30,34) connected by the conductive layer (40) to simultaneously form a metal film (50) on the first and second circuit patterns (30,34) and on the conductive layer (40); and after the electroplating, removing the conductive layer (40) on said cover portion (15) to provide electrical insulation between the first and second circuit patterns (30,34).