发明名称 |
Component with film cooling hole |
摘要 |
<p>The unit has a film cooling hole (28), a substrate (4) and oxidation protecting and heat insulating layers, whereby the hole has a diffuser in an outer area. The diffuser is arranged in the layers, where entire coating thickness is 60 percentage of overall length of the diffuser measured perpendicular to an outside surface of the layers. The hole runs in the layers under specified angle to a substrate outer surface.</p> |
申请公布号 |
EP1712739(A1) |
申请公布日期 |
2006.10.18 |
申请号 |
EP20050007993 |
申请日期 |
2005.04.12 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
BECK, THOMAS;SETTEGAST, SILKE |
分类号 |
F01D5/18;F23R3/04 |
主分类号 |
F01D5/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|