发明名称 Component with film cooling hole
摘要 <p>The unit has a film cooling hole (28), a substrate (4) and oxidation protecting and heat insulating layers, whereby the hole has a diffuser in an outer area. The diffuser is arranged in the layers, where entire coating thickness is 60 percentage of overall length of the diffuser measured perpendicular to an outside surface of the layers. The hole runs in the layers under specified angle to a substrate outer surface.</p>
申请公布号 EP1712739(A1) 申请公布日期 2006.10.18
申请号 EP20050007993 申请日期 2005.04.12
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 BECK, THOMAS;SETTEGAST, SILKE
分类号 F01D5/18;F23R3/04 主分类号 F01D5/18
代理机构 代理人
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