发明名称 RADIAL-BIASED POLISHING PAD
摘要 A polishing layer (140) has an annular polishing track (125) concentric with rotational center (102). The radial micro-channels are formed in the polishing layer within width (133) of the annular polishing track and a majority of the micro channels have a radial orientation and an average width less than 50mu m. An independent claim is included for substrate polishing method.
申请公布号 KR20060108211(A) 申请公布日期 2006.10.17
申请号 KR20060025061 申请日期 2006.03.17
申请人 ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 发明人 MULDOWNEY GREGORY P.
分类号 B24D11/00;B24D99/00;B24B37/26 主分类号 B24D11/00
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