发明名称 |
Back end interconnect with a shaped interface |
摘要 |
An interconnect structure in the back end of the line of an integrated circuit forms contacts between successive layers by removing material in the top surface of the lower interconnect in a cone-shaped aperture, the removal process extending through the liner of the upper aperture, and depositing a second liner extending down into the cone-shaped aperture, thereby increasing the mechanical strength of the contact, which then enhance the overall reliability of the integrated circuit.
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申请公布号 |
US7122462(B2) |
申请公布日期 |
2006.10.17 |
申请号 |
US20030707122 |
申请日期 |
2003.11.21 |
申请人 |
INFINEON TECHNOLOGIES, AG |
发明人 |
CLEVENGER LAWRENCE A.;COWLEY ANDREW P.;DALTON TIMOTHY J.;HOINKIS MARK;KALDOR STEFFEN K.;KALTALIOGLU ERDEM;KUMAR KAUSHIK A.;LA TULIPE, JR. DOUGLAS C.;SCHACHT JOCHEN;SIMON ANDREW H.;SPOONER TERRY A.;WANG YUN-YU;WANN CLEMENT H.;YANG CHIH-CHAO |
分类号 |
H01L21/4763;H01L21/44;H01L21/768;H01L23/522;H01L23/532 |
主分类号 |
H01L21/4763 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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