发明名称 Semiconductor substrate having a partial SOI structure, method of manufacturing the same, a semiconductor device having a partial SOI structure, and method of manufacturing the same
摘要 A semiconductor substrate is disclosed which comprises a first single crystal silicon layer, an insulator formed to partially cover one main surface of the first single crystal silicon layer, a second single crystal silicon layer formed to cover a region of the first single crystal silicon layer which is not covered with the insulator, and to cover an edge portion of the insulator adjacent to the region, and a non-single crystal silicon layer formed on the insulator, the interface between the non-single crystal silicon layer and the second single crystal silicon layer being positioned on the insulator.
申请公布号 US7122864(B2) 申请公布日期 2006.10.17
申请号 US20030439896 申请日期 2003.05.16
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 NAGANO HAJIME;MIYANO KIYOTAKA;MIZUSHIMA ICHIRO
分类号 H01L21/74;H01L27/01;H01L21/00;H01L21/02;H01L21/20;H01L21/322;H01L21/336;H01L21/76;H01L21/762;H01L21/8242;H01L21/84;H01L27/10;H01L27/108;H01L27/12;H01L29/786 主分类号 H01L21/74
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