| 摘要 |
A flame retardant epoxy resin composition for semiconductor encapsulation includes as essential components, (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a phosphazene compound of the average compositional formula (1) having a melting point of 110-130° C., wherein a, b and n are numbers satisfying 0<a<=0.05n, 1.90n<=b<2n, 2a+b=2n, and 3<=n<=6, the composition being substantially free of bromides and antimony compounds.
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