| 发明名称 |
Method of fabricating film carrier |
| 摘要 |
A method of fabricating a film carrier is provided. The method comprises the steps of providing a film; forming a metallic layer on the film, patterning the metallic layer by etching to form a plurality of metallic leads; and, patterning the film by etching to form a plurality of openings so that processing time and manufacturing cost are reduced.
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| 申请公布号 |
US7122124(B2) |
申请公布日期 |
2006.10.17 |
| 申请号 |
US20050906682 |
申请日期 |
2005.03.02 |
| 申请人 |
KINGTRON ELECTRONICS CO., LTD. |
发明人 |
HU DYI-CHUNG;HUANG CHIH-KUNG;WU CHIEN-NAN |
| 分类号 |
B44C1/22;C03C15/00;C03C25/68;C23F1/00;H01B13/00;H01L21/48;H01L23/28;H01L23/498;H05K1/00;H05K3/00;H05K3/06;H05K3/24;H05K3/38;H05K3/40 |
主分类号 |
B44C1/22 |
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